发明名称 |
Barrier metallization in ceramic substrate for implantable medical devices |
摘要 |
The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.
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申请公布号 |
US6146743(A) |
申请公布日期 |
2000.11.14 |
申请号 |
US19990282131 |
申请日期 |
1999.03.31 |
申请人 |
MEDTRONIC, INC. |
发明人 |
HAQ, SAMUEL F.;MALONE, PATRICK F.;VARNER, DONALD P. |
分类号 |
A61N1/02;A61N1/375;H01L21/48;H01L23/498;H05K1/00;H05K1/03;H05K1/09;H05K3/24;H05K3/40;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
A61N1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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