发明名称 |
Magnetic insert into mold cavity to prevent resin bleeding from bond area of pre-mold (open cavity) plastic chip carrier during molding process |
摘要 |
A new method is provided for the creation of a pre-molded chip carrier. The invention teaches putting magnetic inserts into the upper mold. The magnetic inserts attract the lead fingers that are inserted into the upper mold during the process of filling the cavity with a compound pressing the lead fingers tightly against the surface of the magnet. The possibility of mold compound spilling over the lead fingers and forming resin depositions on the surface of the lead fingers is thereby voided. |
申请公布号 |
US6146924(A) |
申请公布日期 |
2000.11.14 |
申请号 |
US19990368858 |
申请日期 |
1999.08.06 |
申请人 |
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
CHANG, DANIEL;HUANG, CHENGDER;TSAO, PEI-HAW |
分类号 |
H01L21/56;(IPC1-7):H01L21/44;H01L21/302 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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