摘要 |
PROBLEM TO BE SOLVED: To eliminate a need of a socket substrate for checking a tester and a test board itself of a test system, and for debagging a test program, and to optionally conduct attachment and detachment for a finished product IC and an IC socket without depending on insertion and removing of a pin. SOLUTION: When a tester 40 or a test board 12 itself of a test system is checked, or when a test program is debagged, a multiple switch 33 with contacts provided on the test board 12 is operated to be closed, so as to connect an IC socket 34 mounted with a finished product IC to an external connection terminal 32. The multiple switch 33 is operated to be opened after finish, and connection between the IC socket 34 and the first terminal group is interrupted to conduct measurement for a wafer 23.
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