发明名称 BOARD FOR MEASURING WAFER
摘要 PROBLEM TO BE SOLVED: To eliminate a need of a socket substrate for checking a tester and a test board itself of a test system, and for debagging a test program, and to optionally conduct attachment and detachment for a finished product IC and an IC socket without depending on insertion and removing of a pin. SOLUTION: When a tester 40 or a test board 12 itself of a test system is checked, or when a test program is debagged, a multiple switch 33 with contacts provided on the test board 12 is operated to be closed, so as to connect an IC socket 34 mounted with a finished product IC to an external connection terminal 32. The multiple switch 33 is operated to be opened after finish, and connection between the IC socket 34 and the first terminal group is interrupted to conduct measurement for a wafer 23.
申请公布号 JP2000314747(A) 申请公布日期 2000.11.14
申请号 JP19990126513 申请日期 1999.05.07
申请人 ROHM CO LTD 发明人 SAWAI YASUO
分类号 G01R31/26;G01R1/073;H01L21/66;(IPC1-7):G01R1/073 主分类号 G01R31/26
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