发明名称 Method of making silicon quantum wires
摘要 A method of making semiconductor quantum wires employs a semiconductor wafer (14) as starting material. The wafer (14) is weakly doped p type with a shallow heavily doped p layer therein for current flow uniformity purposes. The wafer (14) is anodised in 20% aqueous hydrofluoric acid to produce a layer (5) microns thick with 70% porosity and good crystallinity. The layer is subsequently etched in concentrated hydrofluoric acid, which provides a slow etch rate. The etch increases porosity to a level in the region of 80% or above. At such a level, pores overlap and isolated quantum wires are expected to form with diameters less than or equal to 3 nm. The etched layer exhibits photoluminescence emission at photon energies well above the silicon bandgap (1.1 eV) and extending into the red region (1.6-2.0 eV) of the visible spectrum.
申请公布号 US6147359(A) 申请公布日期 2000.11.14
申请号 US19920960694 申请日期 1992.10.14
申请人 THE SECRETARY OF STATE FOR DEFENCE IN HER BRITANNIC MAJESTY'S GOVERNMENT OF THE UNITED KINGDOM OF GREAT BRITAIN AND NORTHERN IRELAND 发明人 CANHAM, LEIGH-TREVOR;KEEN, JOHN MICHAEL;LEONG, WENG YEE
分类号 H01L21/306;H01L29/06;H01L33/34;(IPC1-7):H01L21/265 主分类号 H01L21/306
代理机构 代理人
主权项
地址
您可能感兴趣的专利