| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a slicing method, capable of solving clogging of a wheel and preventing reduction in the processing quality of chipping, etc. SOLUTION: In a method for slicing a processing matter 1 by an outer peripheral blade wheel 6, the processing matter 1 is mounted on a substrate 2 and the both are held in parallelism, while the both are fixed via a low fusing point material layer 3 therebetween, and the processing matter 1 is sliced so that the leading end of the outer peripheral blade wheel 6 is positioned in a middle part of the low meeting point material layer 3. The sliced substrate 2 and a processing matter 1a are heated, and the low fusing point material layer 3 therebetween is meeted to isolate the processing matter 1a from the substrate 2.</p> |
