Guide rail mechanism for a bonding apparatus

摘要

A guide rail mechanism for a bonding apparatus for transferring a workpiece such as a lead frame, etc. including a pair of guide rails each comprising an edge surface guide rail element for guiding the edge surface of the workpiece and an undersurface guide rail element disposed beneath the edge surface guide rail element so as to support the undersurface of the edge portion of the workpiece. A driver for the undersurface guide rail element comprised of a rotational shaft with an eccentric cam portion and other parts is installed so as to move the undersurface guide rail element, thus changing the positional relationship between the edge surface guide rail element and the undersurface guide rail element for workpieces of different thicknesses.