发明名称 SHEET FOR CIRCUIT BOARD AND MOUNTING METHOD OF COMPONENT USING THE SHEET
摘要 <p>PROBLEM TO BE SOLVED: To provide a sheet for circuit board capable of effectively reducing or preventing solder bridge, and a manufacturing method of a circuit board which uses the sheet. SOLUTION: A circuit board 1 has many conducting layers 2. Window holes 4a are formed in a sheet main body 4. The window holes 4a are formed at positions corresponding to the conducting layers 2, which are exposed from the windows. The parts between the window holes 4a turn to partitions 4b partioning adjacent conductor layers 2. By the partitions 4b, solder bridges between the adjacent conducting layers can be reduced or prevented. When the partitions 4b is set high, the positioning of components to the circuit board 1 can be made using the partitions 4b.</p>
申请公布号 JP2000315853(A) 申请公布日期 2000.11.14
申请号 JP19990125106 申请日期 1999.04.30
申请人 FUJI PRINT KOGYO KK 发明人 ARAI MASUMI
分类号 H05K3/34;(IPC1-7):H05K3/34;H01R12/32 主分类号 H05K3/34
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