| 摘要 |
PROBLEM TO BE SOLVED: To secure connection reliability between a lower-layer conductor circuit and an upper-layer conductor circuit as a whole in a multilayered wiring board, even when connection defects occur in some of a plurality of via holes by collectively forming the via holes at formation of via holes through the interlayer insulating layer, on which the upper-layer conductor circuit is formed by a semi-aditive method. SOLUTION: A multilayered printed wiring board is constituted, in such a way that when a connection pad 12 formed on an insulating substrate or the substrate 11 of a printed wiring board is connected to a connection pad 17 formed on an interlayer insulating layer 14 and the connection pad 17 is connected to a connection 26 in an upper-layer conductor circuit 24 formed on an interlayer insulating layer 20, a plurality of via holes 16 and 22 can be formed collectively to share the land. |
