| 摘要 |
PROBLEM TO BE SOLVED: To obtain a metal core-containing printed wiring board, which is excellent in a heat dissipation property, a heat resistance subsequent to moisture absorption and the like and has two-step wire bonding pads. SOLUTION: First, a plurality of truncated core-shaped projections (c) are formed on places on the rear directly opposite to the surface, which is mounted with a semiconductor chip, of a metal plate (a) and clearance holes (d) or slit holes are formed in places other than the places on the rear. Then a glass fiber base material prepreg (h) is put on the flat surface of the metal plate (a) and a substrate (k) with two-step bonding pads (i) formed on the one side of the double-sided copper-clad laminated board is put on the prepreg (h) in such a way that the side of circuits turns inward, prepregs (f) formed by hollowing out the parts of the projections (c) are arranged on the rear and after the substrate (k), the prepreg (h) and the prepregs (f) are lamination-molded on a semiconductor chip (l), a copper foil, a glass fiber base material and a resin on the surface of the metal plate (a) are cut in two times and a cavity type printed wiring board is formed. Moreover, a multifunctional ester cyanate resin composition is used as a thermosetting resin composition. |
