| 摘要 |
PROBLEM TO BE SOLVED: To provide an optimum bonding method for each component, to assure the reliability of a crystal oscillator. SOLUTION: To a print pattern formed on a bottom side of a package main body 7 of an oscillation circuit section being a component of the crystal oscillator, an IC chip 8 being a component of the oscillation circuit section is connected through conductive thermosetting connection with a conductive adhesive via a bump adhered to the chip, and a capacitor 9 is reflow-soldered. If required, the print pattern is broken in the middle so that a land 11a for connection of the IC chip 8 is not in contact with a land 11b for capacitor connection on the front aide, as shown in cross sectional view (c), the broken patterns are connected via an inner print pattern 12, and through-holes or a through-wire 12s so that reflow solder is prevented from flowing to the land of the other end.
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