| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method by which via holes having desired shapes can be formed in a reduced number of steps by preventing the occurrence of air traps or the disconnection of a conductor wiring section in a conductor wiring forming process, etc. SOLUTION: First, an insulating section 3 composed of a negative resist is exposed by using a photomask 5 for carrying a light shielding film 4 which intercepts exposure light beams L, and a transmittance adjusting film 11 which is arranged outside of the film 4 and changes the transmittance of the light beams L. Then a via hole 8, which becomes wider in width as going toward its opening, is formed by developing the exposed insulating section 3 with a developing solution 7.</p> |
