| 摘要 |
PROBLEM TO BE SOLVED: To provide an economical IC card excellent in productivity capable of being laminated without interposing an adhesive layer and its manufacturing method. SOLUTION: This card is a laminated body obtained by printing at least one surface of a substrate 4 consisting of at least one layer or an over sheet 1 consisting of at least one layer with cation hardening paint containing epoxidated diene system block copolymer and containing alicyclic epoxy compound and laminating the substrate 4 and the over sheet 1 by heating and press- fixing them. |
