Polishing machine

摘要

A wafer adapter for a chemical and mechanical polishing (CMP) machine. The adapter includes a retaining ring with multiple grooves formed on one surface of the ring and an inner circle for grasping just a wafer. The grooves have narrower openings at the outer and wider bottoms at the inner circle of the ring. The bottoms are apart from the inner circle with a circular wall. The adapter with wedged grooves served as slurry pools has been proved to have higher polishing efficiency, no wafer lose by sharp edges collision on the wall and less contact pressure between the wafer and the adapter to extend the lifetime of the adapter.