发明名称 |
Fabrication method for encapsulated micromachined structures |
摘要 |
A process for the preparation of hermetically sealed electronically active microstructures involves the preparation of a plurality of microstructures and associated conductive paths and lead bond areas on a single wafer such that areas surrounding the microstructures are maintained in a planar condition. A second wafer having a plurality of microstructure-receiving cavities is placed atop the first wafer and fusion or anodically bonded. The microstructures are preferably connected to lead bond pads which lie outside the surround, the second wafer also having bond pad accessing through-holes to facilitate bonding electrical leads to the devices after sawing from the wafer. The lead-connected devices may be further encapsulated by injection molding, potting, or other conventional encapsulative packaging techniques.
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申请公布号 |
US6146917(A) |
申请公布日期 |
2000.11.14 |
申请号 |
US19970810387 |
申请日期 |
1997.03.03 |
申请人 |
FORD MOTOR COMPANY |
发明人 |
ZHANG, XIA;MCINTYRE, DAVID G.;TANG, WILLIAM CHI-KEUNG |
分类号 |
B81B3/00;B81B7/00;(IPC1-7):H01L29/82 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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地址 |
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