| 摘要 |
PROBLEM TO BE SOLVED: To enhance reliability as a product by forming an insulation film on the surface of a semiconductor chip and making a recess or an opening in the insulation film on the side touching seal resin thereby preventing the seal resin of the semiconductor chip from stripping. SOLUTION: Since openings Q1, Q2 are made in a polyimide layer 13 formed on a wafer 10 fabricated with a semiconductor chip on the side abutting on a seal resin in a chip size package CSP structure, a part of seal resin enters into the openings Q1, Q2 to constitute the anchor of a seal resin layer 19. Even if a significant shearing stress is generated on the interface due to difference in the coefficient of thermal expansion between the wafer 10 and the seal resin layer 19, it is reduced or absorbed effectively by the anchor of the seal resin layer 19 and the seal resin is prevented from being stripped off from the semiconductor chip. Consequently, reliability as a product is enhanced.
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