HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce inductance by a lead structure, miniaturize a hybrid integrated circuit device and reduce processes of manufacturing the hybrid integrated circuit device. SOLUTION: This circuit device 100 is provided with a wiring board obtained by forming circuit wiring 3 on a metal substrate 1 via an insulating film 2. The circuit wiring 3 is integrally formed on the substrate 1. The circuit wiring 3 is provided with leads 3A for external connection which are integrally formed and electrically connected therewith. A semiconductor chip 4 is electrically connected to the circuit wiring 3 with metal wires 5 and other electronic components 6A are electrically connected to the circuit wiring 3. The semiconductor chip 4, metal wires 5, the circuit wiring 3 on the wiring board and respective electrically connecting portions are sealed with a resin-sealed body 7.