发明名称 CONDUCTIVE PARTICULATE AND CONDUCTIVE CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To prevent generation of crack or wrinkle of a metallic coating layer and separation of it from a resin base-material particle, by forming the metallic coating layer around a graft polymeric layer formed around the resin base- material particle. SOLUTION: An average grain size and a grain size variation coefficient of a spherical or spheroidal resin base-material particle 11 made of a linear polymer, a net polymer, a resin material such as thermo-setting resin, or organic or inorganic hybrid material are set in ranges for facilitating formation of a uniform metallic coating layer 13 and joining between micro electrodes. A graft, polymeric layer 12 made of one or more kinds of monomer such as styrene. The metallic coating layer 13 with a single layer or a plurality of layers has a thickness in a range that does not cause high resistance or high cost, and is formed by electroless or electrolytic plating, vacuum deposition, or sputtering of Cu or Ni. The metallic coating layer 13 is engaged with the graft polymeric layer 12 to improve adhesiveness, and is highly reliably used for a conductive connection structure such as a semiconductor element.
申请公布号 JP2000315425(A) 申请公布日期 2000.11.14
申请号 JP19990125958 申请日期 1999.05.06
申请人 SEKISUI CHEM CO LTD 发明人 KAMIYOSHI KAZUHIKO;KODERA YOSHIAKI;UKAI KAZUO
分类号 H01R11/01;C23C18/20;H01B5/00;H01B5/16;H05K3/32;(IPC1-7):H01B5/00 主分类号 H01R11/01
代理机构 代理人
主权项
地址