FLAME-RETARDANT RESIN COMPOSITION AND INSULATION BOARD AND PRINTED CIRCUIT BOARD PRODUCED BY USING THE FLAME- RETARDANT RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a flame-retardant epoxy resin composition free from halogen and phosphorus, having high flame-retardancy and applying little load on the environment. SOLUTION: This composition contains (A) a phenolic novolak epoxy resin, (B) polytriphenolmethane as a curing agent and (C) aluminum hydroxide as essential components. The composition is essentially free from halogen and phosphorus. The amount of the component C is preferably >=150 pts.wt. based on 100 pts.wt. of the resin.