发明名称 COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To miniaturize an image processing unit, in particular a background plate of a component mounting apparatus. SOLUTION: Resin surface layers 11a and 11b are formed by providing small irregularities on the surfaces of a resin layer 12. The resin surface layers 11a and 11b disperse an incident light in all directions by the irregularities. The resin layer is composed of a material having high transmittance, and makes the lights dispersed by the resin surface layers 11a and 11b pass through as they are. An evaporated aluminum layer 13 is formed by aluminum evaporating processing on a background plate 10, that is constituted by the resin layer 12 and the resin surface layers 11a and 11b and reflects most of the incident lights.
申请公布号 JP2000315899(A) 申请公布日期 2000.11.14
申请号 JP19990122381 申请日期 1999.04.28
申请人 SONY CORP 发明人 MAEKAWA YUKITAKE
分类号 H05K13/08 主分类号 H05K13/08
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