| 摘要 |
PROBLEM TO BE SOLVED: To prevent breaking in signal patterns extending from foot patterns, even if a printed circuit board and BGA parts are subjected to stresses with regard to the printed circuit board and a semiconductor device. SOLUTION: This printed circuit board includes a plurality of insulating layers and a plurality of conductor layers, and the outermost conductor layer has a family of foot patterns for mounting BGA parts and signal patterns. The width of at least a part of the signal pattern 30a, extending from the foot pattern 24a in the outer row, is larger than the width of the signal pattern 30b extending from the foot pattern 24b in the inner row. The printed circuit board is further provided with a protective layer, which covers the signal pattern of the outermost conductor layer, and the protective layer 29 has openings 32 for exposing the foot patterns.
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