| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device on which the damage of an electric pad can be prevented, the defective short circuit between an inner lead and a semiconductor chip can be prevented and the increase of warpage of a package can also be prevented. SOLUTION: This semiconductor device is composed of an electrode pad 7, a protective film (passivation film) 8 formed in such a manner that at least a part of the surface of the electrode pad 7 is exposed, a semiconductor chip 1 on which the electrode pad 7 and a metal film wiring, to be electrically connected to the electrode pad 7 on the protective film 8, are provided on the surface, leads 5a and 6, a conductive member 10, with which the metal film wiring 9 and the leads 5a and 6 are electrically connected, and a molding resin 2 which seals at least the circumference of a semiconductor element. |
