发明名称 |
Semiconductor wafer treatment |
摘要 |
Method and apparatus for cleaning semiconductor devices and other workpieces using an aqueous rinse solution which is de-oxygenated and hydrogen enriched by passing the aqueous rinse solution and a treatment fluid through an osmotic membrane degasifier. In the preferred embodiment, only a single component, forming gas, is employed to provide both functions of oxygen removal and hydrogen injection.
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申请公布号 |
US6146468(A) |
申请公布日期 |
2000.11.14 |
申请号 |
US19990263336 |
申请日期 |
1999.03.05 |
申请人 |
SPEEDFAM-IPEC CORPORATION |
发明人 |
DRYER, PAUL WILLIAM;TIRENDI, RICHARD SCOTT;SUNDIN, JAMES BRADLEY |
分类号 |
B08B3/10;B01D19/00;B01D61/00;B08B3/04;C02F1/20;C02F1/36;C02F1/66;H01L21/00;H01L21/304;(IPC1-7):B08B3/04 |
主分类号 |
B08B3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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