COMMUNICATION UNIT AND TIS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To surely obtain a shield effect of an RF circuit module of a communication unit provided with the RF circuit module by reducing number of components of the communication unit so as to decrease the component cost and to simplify the assembling thereby reducing the manufacture cost. SOLUTION: The circuit components are mounted on an upper face of a printed circuit board 3 of an RF circuit module 1. A shield use metallic conductor 35 is provided to a lower side of the printed circuit board 3. The printed circuit board 3 is assembled with a shield use frame 2 to manufacture the RF circuit module 1. The RF circuit module 1 that is upside down is mounted on a mother board 4. Metallic conductors 41, 43 are provided to a mount position of the RF circuit module 1 on the upper side of the mother board 4. The shield effect of the RF circuit module 1 is obtained by the metallic conductors 41, 43 and the frame 2.