| 摘要 |
PROBLEM TO BE SOLVED: To provide chip type electronic parts which have a small size and flatness and can be soldered surely. SOLUTION: An insulating seat plates 20 are put on the end sections of electronic parts 10, and flat metallic terminal sections 22 are integrally molded with the seat plates 20. Then a lead wire inserting hole 25 is formed. In addition, junction surface sections 26 are formed by forming steps 23 at the hole 25 side ends of the seats 20, and the front flat terminal sections 21 of lead wires 11 are welded to the junction surface sections 26 in bent states. Since the terminal sections 21 of the lead wires 11 are flattened and welded in the bent states so that the lengths of the terminal sections 21 may be reduced as much as possible, the terminal sections 21 do not come up, but have high flatness. It is also possible to bend the flat terminal sections 21 in advance and insert the sections 21 into the hole 25 from a guide groove 30 formed on the seat plate 20.
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