发明名称 BONDING COMPOSITION
摘要 Provided is a bonding composition which, not requiring any pre-treatment such as acid-etching treatment or priming treatment, exhibits high initial bonding strength and good bonding durability. It comprises a mixture of an acid group-having polymerizable compound, a water-soluble film-forming agent, water, and a curing agent, in which the calcium salt of the acid is insoluble in water, and the film-forming agent is a polymerizable compound and is miscible with a physiological saline solution.
申请公布号 CA2307482(A1) 申请公布日期 2000.11.13
申请号 CA20002307482 申请日期 2000.05.03
申请人 KURARAY CO., LTD. 发明人 HINO, KENICHI
分类号 A61K6/08;A61K6/00;C09J4/02;C09J201/00;C09J201/02;(IPC1-7):A61K6/083 主分类号 A61K6/08
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