| 摘要 |
<p>The invention relates to a fabrication method and technique for producing functional devices where active and/or passive components are embedded and interconnected during the substrate fabrication process. It is characteristic for the invention that the active and passive components are embedded into low-cost polymer substrates, preferably flexible, and interconnected using photodefinable dielectrics and the electroless copper deposition. Besides embedding passive components they can be fabricated using dielectrics and electroless deposition processes. The fabrication is carried out at ambient temperatures without vacuum-based processes like evaporation or sputtering. It is also an important advantage of the invention that wire bonding or soldering are not needed, since the latter interconnection techniques will meet increasing difficulties with higher frequencies and smaller interconnection volumes. The interconnections of active components produced with a technique according to the present invention are electrically very good and their mechanical reliability is superior to those produced with the existing techniques.</p> |
