| 摘要 |
<p>A stackable flex circuit IC package includes a flex circuit comprised of a flexible base (32) with a conductive pattern (20) thereon, and wrapped around at least one end portion of a frame (18) so as to expose the conductive pattern at the edge portion. An IC device (50) is mounted within a central aperture in the frame, and is electrically coupled to the conductive pattern by wire bonds (58). The IC device is sealed in place within the frame with epoxy (24). A stack of the IC packages is assembled by disposing a conductive epoxy of anisotropic material between the conductive patterns at the edge portions of adjacent IC packages.</p> |
