摘要 |
A process for making flexible circuits wherein the etching of a polymeric fi lm is accomplished by dissolving portions thereof with concentrated aqueous bas e using a UV-curable 100 % active liquid photoresist as a mask, comprising the steps of laminating the resist on a polymeric film, exposing a pattern into the resist, developing the resist with a dilute aqueous solution until desir ed image is obtained, etching portions of the polymeric film not covered by the crosslinked resist with a concentrated base at a temperature of from 50 ~C t o 120 ~C, and then stripping the resist off the polymeric film.
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