Poliergerät

摘要

A polishing apparatus (10) for polishing a surface of a workpiece such as a semiconductor wafer is installed in a clean room (C). The polishing apparatus comprises a polishing section having a turntable (12) with an abrasive cloth mounted on an upper surface thereof, a top ring (11) for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, a loading section for loading the workpiece to be polished onto the top ring, an unloading section for unloading the workpiece which has been polished from the top ring, a cover (17,18) which covers an entire moving area of the top ring including the polishing section, the loading section and the unloading section, and an exhaust duct (19) for discharging air of an interior space of the cover to an outside of an installation space (20) of the polishing apparatus.