发明名称 |
Contact arrangement used in the manufacture of switches and contacts has a metallic layer arranged between a contact piece and a contact support |
摘要 |
Contact arrangement (10) has two contact pieces (14) soldered to a contact support (11). A first contact piece is fixed to the vertical lower end of the connected contact support by the contact pieces. A metallic layer is arranged between the first contact piece and the contact support to act as a diffusion block or for reducing diffusion for the materials. Preferred Features: The contact piece is made of copper or copper-containing material. The contact piece has a component made of silver.
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申请公布号 |
DE19921475(A1) |
申请公布日期 |
2000.11.09 |
申请号 |
DE19991021475 |
申请日期 |
1999.05.08 |
申请人 |
ABB PATENT GMBH |
发明人 |
GENTSCH, DIETMAR;HEIMBACH, MARKUS |
分类号 |
H01H1/02;H01H11/04;(IPC1-7):H01H11/06;H01H33/66 |
主分类号 |
H01H1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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