发明名称 Contact arrangement used in the manufacture of switches and contacts has a metallic layer arranged between a contact piece and a contact support
摘要 Contact arrangement (10) has two contact pieces (14) soldered to a contact support (11). A first contact piece is fixed to the vertical lower end of the connected contact support by the contact pieces. A metallic layer is arranged between the first contact piece and the contact support to act as a diffusion block or for reducing diffusion for the materials. Preferred Features: The contact piece is made of copper or copper-containing material. The contact piece has a component made of silver.
申请公布号 DE19921475(A1) 申请公布日期 2000.11.09
申请号 DE19991021475 申请日期 1999.05.08
申请人 ABB PATENT GMBH 发明人 GENTSCH, DIETMAR;HEIMBACH, MARKUS
分类号 H01H1/02;H01H11/04;(IPC1-7):H01H11/06;H01H33/66 主分类号 H01H1/02
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