发明名称 Ferroelectric memory structure is produced by forming vias and conductive structures for connecting short-circuit transistors to upper capacitor electrodes
摘要 Ferroelectric memory structure production, comprising formation of vias and conductive structures for connecting short-circuit transistors to upper capacitor electrodes, is new. A ferroelectric memory structure is produced by: (a) preparing a substrate with several memory cells, each comprising selection and short-circuit transistors connected to a first electrode of a ferroelectric capacitor; (b) applying an electrically insulating layer; (c) producing a contact hole for connection to the second capacitor electrodes; (d) producing contact holes for connection of the short-circuit transistors; (e) filling the contact holes with conductive material; and (f) applying and structuring a conductive layer so that the second capacitor electrodes are connected to the short-circuit transistors.
申请公布号 DE19929308(C1) 申请公布日期 2000.11.09
申请号 DE19991029308 申请日期 1999.06.25
申请人 SIEMENS AG 发明人 SCHINDLER, GUENTHER;BERGMANN, RENATE;DEHM, CHRISTINE;ROEHR, THOMAS;BRAUN, GEORG;HOENIGSCHMID, HEINZ
分类号 H01L21/8246;H01L27/115;(IPC1-7):H01L21/823;H01L27/105 主分类号 H01L21/8246
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