A METHOD AND APPARATUS FOR INSPECTING SOLDER PASTE DEPOSITS ON SUBSTRATES

摘要

The invention relates to a method and apparatus for inspecting a substrate having a substance deposited thereon. The steps of the method include depositing the substance onto the substrate; capturing an image of the substrate; detecting variations in texture in the image to determine a location of the substance on the substrate; and comparing the location of the substance with a desired location. The apparatus includes a screen printer that dispenses a substance at a predetermined location on a substrate, and a machine vision inspection system that includes texture based recognition of the substance.