METHOD FOR PRODUCING WELD POINTS ON A SUBSTRATE AND GUIDE FOR IMPLEMENTING SAID METHOD

摘要

The invention concerns a method for moulding and soldering electrical connection studs on mounting lands (12) for electrical connection in circuits or electronic components. The method comprises a step which consists in injecting a conductive liquid alloy (48) into a guide open at one end located opposite the component mounting land. The guide is formed by two separable parts, a mould (16) and an injection matrix (18) with a shrunk portion of the guide at the interface of the parts, and in separating the guide parts while the alloy is still in liquid phase. The invention is useful for producing connection studs on substrates and electronic components.