| 摘要 |
A semiconductor laser module which enables reliability to be improved while preventing defect that when solder bonds the substrate mounting the semiconductor laser to the electronic cooler, flowing solder flows into the electronic cooler, thus the electronic cooler does not function caused by the short circuit. There is provided a cylindrical insulator made of ceramics such as forsterite and so forth for surrounding an electronic cooling element on an upper-surface substrate and a lower-surface substrate which put the electronic cooling element therebetween. It prevents the defect that excessive solder flows into the electronic cooling element in the case where the lower-surface substrate is soldered to the module package, or when a substrate mounting the semiconductor laser is soldered to the upper-surface substrate. <IMAGE> |
