发明名称 Semiconductor device and method for fabricating the same
摘要 A semiconductor device includes a substrate, a multi-layer structure provided on the substrate, a first-conductive-type etch stop layer of a III nitride provided on the multi-layer structure, and a second-conductive-type first semiconductor layer of a III nitride provided on the etch stop layer. A molar fraction of Al is lower in a composition of the III nitride included in the first semiconductor layer than in a composition of the III nitride included in the etch stop layer. <IMAGE>
申请公布号 EP0997996(A3) 申请公布日期 2000.11.08
申请号 EP19990120838 申请日期 1999.10.25
申请人 MATSUSHITA ELECTRONICS CORPORATION 发明人 NAKAMURA, SHINJI;YURI, MASAAKI;ORITA, KENJI
分类号 H01S5/30;H01L33/00;H01L33/06;H01L33/14;H01L33/32;H01S5/323;H01S5/343 主分类号 H01S5/30
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