发明名称 ELECTRONIC COMPONENT MOUNTING UNIT
摘要 PROBLEM TO BE SOLVED: To offer an electronic component mounting unit, which can mount electronic components on a substrate with a shorter tact time by using a transfer head provided with two or more nozzles. SOLUTION: In this electronic component mounting unit, nozzles N1-N4 of a transfer head 10 pick up electronic components A and B by using suction force and moves above a camera 11 which is a picture-taking means. An image of all the electronic components is taken by the camera 11 during a single moving operation, and then the electronic components A and B are mounted on a substrate. Cylinders 18, 19, 42, and 43 allow selection from among nozzles N1-N4 to be used and causes a Z motor 14 to lower the transfer head 10 to mount the electronic components A and B on the substrate.
申请公布号 JP2000312097(A) 申请公布日期 2000.11.07
申请号 JP20000110306 申请日期 2000.04.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAGUCHI HIROYUKI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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