| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device, where a semiconductor element can be connected direct to a printed board or the like, without using a base board when the semiconductor element is packaged so as to make its element formation surface face upward (face-up). SOLUTION: Pad electrodes 6 are formed on an element-forming surface of a semiconductor element 1, through-holes are bored in the element-forming surface near to the pad electrodes 6 penetrating the element 1 so as to reach its rear, a metal 8 connected to the pad electrode 6 is put through the through- hole, so that an electrode connection can be made through the rear of a chip. With this constitution, when a semiconductor element is packaged so as to make its element-forming surface face upward (face-up), an electrode connection can be made through the rear of a chip, so that a semiconductor device can be connected directly to a printed board or the like. |
