发明名称 ELECTRONIC COMPONENT MOUNTING UNIT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting unit which can mount electronic components on a substrate with a shorter tact time by using a transfer head provided with two or more nozzles. SOLUTION: This electronic component mounting unit is provided with positioning means 2 and 3, which positions a substrate 4, a component feeder 5 which feeds electronic components to be mounted on the substrate 4, a transfer head 10 having two or more nozzles which pick up electronic components from the component feeder 5, mount them on the substrate 4 positioned by the positioning means 2 and 3, and suck them, moving means 8 and 9 which relatively move the substrate 4 and transfer head 10, a line image sensor 11 which takes an image of electronic components sucked by nozzles of the transfer head 10 during a single moving operation of the transfer head 10.
申请公布号 JP2000312096(A) 申请公布日期 2000.11.07
申请号 JP20000110305 申请日期 2000.04.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAGUCHI HIROYUKI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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