发明名称 |
Compound laminate for printed circuit boards |
摘要 |
It includes two outer sheets of continuous-strand fiberglass fabric and a core of non-woven fiberglass formed by sheets of fiberglass paper, all sheets being impregnated with epoxy resin, and presenting at least one sheet of conducting material, on one or both outer sides; it is characterized in that it incorporates in the non-woven fiberglass core at least one intermediate sheet of fiberglass fabric impregnated with resin. It allows manufacturing of reliable printed circuits, even when using surface-mounted components, while at the same time its cost is relatively low; it is particularly suitable for the field of consumer and semi-professional electronics.
|
申请公布号 |
US6143414(A) |
申请公布日期 |
2000.11.07 |
申请号 |
US19980150791 |
申请日期 |
1998.09.10 |
申请人 |
COCA, FELIP BALSELLS;SIURANA, ANTONIO RODRIGUEZ |
发明人 |
COCA, FELIP BALSELLS;SIURANA, ANTONIO RODRIGUEZ |
分类号 |
B29C70/08;B29C70/88;H05K1/03;(IPC1-7):B32B27/38 |
主分类号 |
B29C70/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|