发明名称 Compound laminate for printed circuit boards
摘要 It includes two outer sheets of continuous-strand fiberglass fabric and a core of non-woven fiberglass formed by sheets of fiberglass paper, all sheets being impregnated with epoxy resin, and presenting at least one sheet of conducting material, on one or both outer sides; it is characterized in that it incorporates in the non-woven fiberglass core at least one intermediate sheet of fiberglass fabric impregnated with resin. It allows manufacturing of reliable printed circuits, even when using surface-mounted components, while at the same time its cost is relatively low; it is particularly suitable for the field of consumer and semi-professional electronics.
申请公布号 US6143414(A) 申请公布日期 2000.11.07
申请号 US19980150791 申请日期 1998.09.10
申请人 COCA, FELIP BALSELLS;SIURANA, ANTONIO RODRIGUEZ 发明人 COCA, FELIP BALSELLS;SIURANA, ANTONIO RODRIGUEZ
分类号 B29C70/08;B29C70/88;H05K1/03;(IPC1-7):B32B27/38 主分类号 B29C70/08
代理机构 代理人
主权项
地址