| 摘要 |
PCT No. PCT/JP97/00473 Sec. 371 Date Aug. 20, 1998 Sec. 102(e) Date Aug. 20, 1998 PCT Filed Feb. 20, 1997 PCT Pub. No. WO97/31394 PCT Pub. Date Aug. 28, 1997The present invention is characterized, in a semiconductor device with a semiconductor element sealed by resin, in that a metallic foil is bonded through adhesive to the bottom of a lead frame with the semiconductor element mounted thereon, and another metallic foil is fixed to the outer surface of the sealing resin on the side of the semiconductor element. Such a configuration provides a semiconductor device free from warp. In addition, the effect of no warp and metallic foils on the upper and lower surfaces of the semiconductor device provides a reliable semiconductor device with excellent heat dissipation, less influence from moisture absorption and high thermal stress resistance.
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