发明名称 Electronic coatings
摘要 The instant invention pertains to a multi-layer tamper proof electronic coating wherein the first layer is a protecting layer produced from a preceramic silicon containing material and at least one filler. The second layer is a resin sealer coat produced from a sealer resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, polyimide polymers, siloxane polyimides and parylenes. An optional third layer is a cap coating layer selected from SiO2 coating, SiO2/ceramic oxide coating, silicon containing coatings, silicon carbon containing coatings, silicon nitrogen containing coatings, silicon oxygen nitrogen coatings, silicon nitrogen carbon containing coatings and/or diamond like coatings. An optional fourth layer is a resin overcoat produced from an overcoat resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, polyimide polymers, siloxane polyimides, parylenes, photoresist polymers, siloxane room temperature vulcanizable compositions, or other organic polymer. The use of the multi-layer coating on the electronic device results in an electronic device that is resistant to analytical techniques such as ozone, UV-ozone, gaseous free radicals and ions, vapor or liquid borne reactive species, plasma, abrasion, radiation, light, wet etching and others; moisture; chemicals and other environmental contaminants; shock and erosion, delamination and/or separation.
申请公布号 US6144106(A) 申请公布日期 2000.11.07
申请号 US19970939241 申请日期 1997.09.29
申请人 DOW CORNING CORPORATION 发明人 BEARINGER, CLAYTON R.;CAMILLETTI, ROBERT CHARLES;HALUSKA, LOREN ANDREW;MICHAEL, KEITH WINTON
分类号 B05D7/00;B05D7/24;B32B9/00;H01L21/312;H01L23/29;H01L23/31;H01L23/58;(IPC1-7):H01L23/29 主分类号 B05D7/00
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