发明名称 |
Process for assembling an interposer to probe dense pad arrays |
摘要 |
Disclosed is a process to manufacture an interposer which includes an interposer socket assembly to use in probing dense pad arrays that minimizes the associated extraneous pin loading and cross-talk caused by a probe tip. The process comprises the steps of: mounting a number of resistors onto a number of predetermined positions in a pad array on an interposer board; inserting a number of interposer pins of a pin socket into the pads of the pad array on the interposer board, wherein the ends of the interposer pins protrude through the interposer board; placing a solder preform around the ends of the interposer pins; and, heating the solder preforms in a solder re-flow oven to solder the interposer pins to the respective pads of the pad array.
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申请公布号 |
US6144559(A) |
申请公布日期 |
2000.11.07 |
申请号 |
US19990288343 |
申请日期 |
1999.04.08 |
申请人 |
AGILENT TECHNOLOGIES |
发明人 |
JOHNSON, KENNETH W;ZAMBORELLI, THOMAS J;BARTOSCH, LARRY |
分类号 |
H01R31/06;G01R1/04;H01L23/32;H01R43/00;H05K1/02;H05K3/34;(IPC1-7):H05K1/18 |
主分类号 |
H01R31/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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