发明名称 Process for assembling an interposer to probe dense pad arrays
摘要 Disclosed is a process to manufacture an interposer which includes an interposer socket assembly to use in probing dense pad arrays that minimizes the associated extraneous pin loading and cross-talk caused by a probe tip. The process comprises the steps of: mounting a number of resistors onto a number of predetermined positions in a pad array on an interposer board; inserting a number of interposer pins of a pin socket into the pads of the pad array on the interposer board, wherein the ends of the interposer pins protrude through the interposer board; placing a solder preform around the ends of the interposer pins; and, heating the solder preforms in a solder re-flow oven to solder the interposer pins to the respective pads of the pad array.
申请公布号 US6144559(A) 申请公布日期 2000.11.07
申请号 US19990288343 申请日期 1999.04.08
申请人 AGILENT TECHNOLOGIES 发明人 JOHNSON, KENNETH W;ZAMBORELLI, THOMAS J;BARTOSCH, LARRY
分类号 H01R31/06;G01R1/04;H01L23/32;H01R43/00;H05K1/02;H05K3/34;(IPC1-7):H05K1/18 主分类号 H01R31/06
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