发明名称 CURABLE (METH)ACRYLIC RESIN COMPOSITION, CURED MOLDING AND ITS PRODUCTION
摘要 PROBLEM TO BE SOLVED: To obtain a curable (meth)acrylic resin composition capable of producing a cured molding excellent in preservation stability, having a rapid curing velocity and excellent in hot water resistance by making the composition contain a thermosetting (meth)acrylic resin and a specific curing agent. SOLUTION: This thermosetting (meth)acrylic resin composition is made to contain (A) a thermosetting (meth)acrylic resin and (B) a curing agent which is an organic peroxide expressed by the formula (R is a 5-8C t-alkyl), (e.g. t-hexylperoxyiospropylcarbonate and the like) in preferably 0.5-2 wt.% of the ingredient B based on the ingredient A. The ingredient A is generally a (meth) acrylic syrup in which a (meth)acrylic resin such as a polymethyl methacrylate or the like is dissolved in a radically polymerizable unsaturated monomer (e.g. methyl methacrylate, etc.), containing a radically polymerizable unsaturated monomer (e.g. neopentylglycol dimethacrylate, etc.), having >=2 unsaturated groups in a molecules as an essential ingredient. The composition is useful for producing artificial marbles.
申请公布号 JP2000309674(A) 申请公布日期 2000.11.07
申请号 JP19990117408 申请日期 1999.04.26
申请人 NOF CORP 发明人 NAGAI KENJI;UJIGAWA NORIHISA
分类号 C08J5/00;C04B26/06;C04B111/54;C08K5/14;C08L33/10;(IPC1-7):C08L33/10 主分类号 C08J5/00
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