发明名称 DEVICE AND METHOD TO CONTINUOUSLY SUPPLY POLISHING SLURRY AND TO ADJUST IT
摘要 <p>PROBLEM TO BE SOLVED: To carry out a polishing and manufacturing process continuously for a long period of time, to reduce manufacturing cost and to improve productive efficiency as a whole by using a slurry distribution system capable of easily changing composition of slurry and to adjust it in accordance with a parameter of the process. SOLUTION: A continuous slurry supply system 100 is furnished with a mixing chamber 110, a slurry dispenser 115, a slurry component tank, a chemical parameter sensor system 130 and a control system 140. Capacity of the mixing chamber 110 is comparatively small in comparison with an overall supply system. The mixing chamber 110 is supplied to a polishing platen/pad 170 of a polishing device 180. The mixing chamber 110 is furnished with an agitator 150 to violently agitate contents of the mixing chamber 110 so as to make roughly homogeneous slurry to be supplied to a polishing platen/pad 170 of a polishing device 180. The chemical parameter sensor system 130 is connected to the mixing chamber 110 and senses a chemical characteristic by a sensor 135.</p>
申请公布号 JP2000308957(A) 申请公布日期 2000.11.07
申请号 JP20000104262 申请日期 2000.04.06
申请人 LUCENT TECHNOL INC 发明人 OBENG YAW SAMUEL;SCHULTZ LAURENCE D
分类号 B24B37/04;B24B57/02;H01L21/304;(IPC1-7):B24B37/00 主分类号 B24B37/04
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