| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive which can give a cured product having a low density and a low hardness and, when applied to a material for a model, can give a product capable of being subjected to processing such as cutting-off, boring, cutting, and sandpapering without leaving appreciable unlevelness at the bonded or repaired part. SOLUTION: This adhesive is a urethane-based adhesive comprising an active- hydrogen-containing compound and an organic polyisocyanate and further comprising 0.5-40 wt.%, based on the entire adhesive, filler comprising microballoons, and 1-40 wt.% dehydrating agent. A material for a model is bonded or mended with the adhesive.
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