发明名称 INSPECTION METHOD FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To inspect a sealed part with high accuracy and at high speed by a method wherein the sealed part is measured by an image sensor, an image is formed, the image is changed into a pixel, the pixel of the sealed part in a support part is calculated, the pixel is compared with a preset reference pixel number region and whether the sealed part is good or not is judged. SOLUTION: After an operation is started, the imaging treatment of a sealed part by a glass tube is executed. A DHD 10 which is at a standstill in the set position of a product receiver jig 27 is photographed with a CCD camera 24. Image information by the CCD camera 24 is sent to an amplifier 30 so as to be processed, and the image information is displayed on a liquid crystal color monitor 33. The large diameter part of the sealed body of the DHD 10 is displayed on a window. A stud part which is displayed on the window is designated by a console 32. The stud part is displayed on the liquid crystal color monitor 33, and the number of pixels of the stud part in the window is calculated. The measured number of pixels is compared with a reference pixel number region so as to be judged. As a result, whether the sealed part is good or not can be inspected with high accuracy and at high speed.
申请公布号 JP2000311910(A) 申请公布日期 2000.11.07
申请号 JP19990118304 申请日期 1999.04.26
申请人 HITACHI LTD 发明人 SAITO TOSHINAO
分类号 H01L21/56;G01R31/26;(IPC1-7):H01L21/56 主分类号 H01L21/56
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