发明名称 METHOD OF PEELING RESIST ON ELECTROPHOTOGRAPHIC PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To rapidly and easily peel a resist by removing the whole or a part of a toner layer from the surface of a photoconductive layer before the resist peeling process to remove a residual photoconductive layer and a toner image by using a strong alkali aq.soln. SOLUTION: In the production process of a printed circuit board, before the resist peeling process to remove a residual photoconductive layer and a toner image by using a strong alkali aq.soln., a process of removing the whole or a part of a toner layer from the photoconductive layer is carried out. Moreover, in the treating process, fast resist peeling can be performed by using an org. solvent which easily dissolves or swells the toner layer. Since the toner used acts as a resist agent in the developing process to dissolve and remove the portion except for the toner image after developing the toner, it is required that the toner consists of a resin component which is insoluble with a weak alkali developer such as about 1% sodium carbonate aq.soln. in a practical elusion treatment time.
申请公布号 JP2000310889(A) 申请公布日期 2000.11.07
申请号 JP19990119049 申请日期 1999.04.27
申请人 MITSUBISHI PAPER MILLS LTD 发明人 IRISAWA MUNETOSHI;KANEDA YASUO
分类号 H05K3/06;G03G13/26;(IPC1-7):G03G13/26 主分类号 H05K3/06
代理机构 代理人
主权项
地址
您可能感兴趣的专利