| 摘要 |
<p>PROBLEM TO BE SOLVED: To speedily and easily fit IC to the metallic film substrate of an RF antenna by bridging the two parts of the antenna through an interposer by exceeding a gap. SOLUTION: A gap 46 exists between contact pads 34 and 36 so that these surfaces are electrically separated. The contact pads 34 and 36 enable wide and effective electric contact. Thus, accuracy requested for the positioning of IC in the middle of manufacture is relieved but more effective electric contact is secured. A sub-assembly includes IC 10 which is brought into contact with the contact pads 34 and 36 of an interposer 30 and which is installed on the interposer 30. The sub-assembly is bonded to a basic circuit board to form a device. For example of the embodiment, the sub-assembly is bonded to the thin metallic film antenna and forms a radio frequency identification tag(RFID) and the like.</p> |
