SEMICONDUCTOR DEVICE AND BONDING METHOD

摘要

PROBLEM TO BE SOLVED: To obtain a method of assembling a semiconductor device. SOLUTION: Wire loops 44 are formed on bonding pads 42 of a semiconductor chip 41 to be at a uniform height and perpendicular with respect to the circuit surface of the chip. Each of the loops has a large diameter and a small diameter and orient parallel to the opening surface, and the direction and size of their tops have fixed offsets from the centers of bonding pads. The chip is secured tightly to a substrate 46 through reform-flowing a solder material 48 on contact pads 47 of the substrate, or using a conductive adhesive.