发明名称 |
Method for forming alignment mark |
摘要 |
A method for forming an alignment mark includes defining a circuit pattern area and an alignment mark area on a semiconductor substrate, forming a first pattern in the alignment mark area, forming a second pattern of a first material on the first pattern, forming a layer of a second material different from the first on the entire surface of the semiconductor substrate, and polishing the layer of the second material and the second layer such that the second pattern and the layer of second material are polished at different speed, until a step difference appears between the second pattern and the layer.
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申请公布号 |
US6143622(A) |
申请公布日期 |
2000.11.07 |
申请号 |
US20000478805 |
申请日期 |
2000.01.07 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
YAMAMOTO, YASUHIRO;WATANABE, AKIRA |
分类号 |
H01L21/027;G03F9/00;H01L21/304;H01L23/544;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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